Enabled by Qualcomm Dragonwing QCS6490 delivering always-on connectivity for edge AI.
Evaluation kit for Ultra-Low-Power Wi-Fi Module with your NXP Kinetis Microcontroller
The SX-ULPAN-EVK is an evaluation kit designed to evaluate our ultra-low-power Wi-Fi module based on Qualcomm's QCA4004 chipset in conjunction with the NXP Kinetis MCU's.
The SX-ULPAN-EVK, an ultra-low-power dual-band 802.11 a/b/g/n Wi-Fi tower module with industrial temperature support, enables leading-edge reliable Wi-Fi connectivity for the development of connected devices. This peripheral module for the Tower System features a fully certified Wi-Fi module with the Silex SX-ULPAN on-board.
External Interface: Serial I/F (RS232C Level)
Display LED's:
You will need the following tools that are not included in the EVK in order to evaluate the product:
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