Silex goes the extra mile to ensure the EP-200Q benefits fully from Qualcomm's longevity program for the Dragonwing QCS6490.
The longevity of the system-on-module (SoM) is not dictated by the main processor, but also other components. As it integrates several components from different manufacturers, the longevity commitment from one vendor is not enough to commit to the longevity of the SoM. Silex always take into account the long term component availability when reviewing a vendor's reference design and choose the components based on our assessment. Although deviating from the reference design complicates system bring-up, Silex takes on that complexity to secure long-term advantages for customers
Below are just a few examples of how Silex ensures the longevity of the EP-200Q.
Some SoM manufacturers using Dragonwing QCS6490 choose to use uMCP (micro Multi-Chip Package), which integrates LPDDR memory and non-volatile memory to support small footprint. However, in general, uMCP is targeted for mobile devices, of which the product cycle is relatively short. Because this technology is rapidly evolving to increase the memory bandwidth, capacities and power consumption, it is often that older generations of uMCP could face EOL in 5 to 7 years. There is no guarantee that a successor uMCP is compatible with what's been used today, which may result in EOL of the SoM, or at least requiring design change of the SoM within the design.
Therefore, Silex chose discrete LPDDR memory and eMMC storage which are available for industrial users who typically requires over 7 years or 10+ years. However, using discrete components requires more footprint than uMCP.
While Silex incorporated two discrete components, typically area-consuming devices, Silex did not compromise the SoM size. At 35mm x 40mm, it remains competitive with the smallest SoM using uMCP, which measures 33mm x 39mm.
We have also conducted extensive testing throughout the design and assembly processes to ensure there are no quality assurance concerns arising from the denser assembly
A hiccup during system bring-up can occur when selecting components based on the reference design, especially if the required BSP differs. Silex continuously gathers platform knowledge throughout the process to better support our customers.
Partner with Silex to secure a system-on-module designed for industrial longevity, robust performance, and dependable support.
Contact us today to learn how the EP-200Q can future-proof your product longevity