coming soonSX-SDMAC2 

IEEE 802.11ac 2x2 Wi-Fi plus Bluetooth Combo Wireless LAN Module

The SX-SDMAC2 is a  dual band IEEE802.11 a/b/g/n/ac WLAN and Bluetooth 5.0 BR/EDR/LE (Class1) module based on Qualcomm QCA9379-3 chipset.  It supports 2x2 antenna configuration for applications that require higher performance. Silex has separated the Bluetooth antenna form the Wi-Fi creating a third antenna port, allowing concurrent operation of Wi-Fi and Bluetooth further optimizing the Wi-Fi and Bluetooth performance.

Based on Qualcomm’s QCA9379 chipset featuring 2x2 MU-MIMO

The Silex SX-SDMAC2 is dual-band IEEE 802.11 a/b/g/n/ac WLAN SDIO module plus Bluetooth 5.0 BR/EDR/LE combo module. It is based on Qualcomm’s QCA9379 System-on-Chip. Its 2x2 wave 2 (MU-MIMO) antenna architecture makes it an ideal for applications needing high data transmission rates e.g video streaming, HD medical imaging, printers and scanners
(MFP), surveillance cameras, point of sale equipment (POS) etc.

The SX-SDMAC2 is Dual band SDIO module with 802.11 a/b/g/n/ac WLAN plus BT 5.0. With 2x2 MU-MIMO, it offers improved WLAN throughput, range and robust Wi-Fi Connectivity.

Powered by QCA9379-3 Chip by Qualcomm

Dual Band Support for both 2.4GHz / 5GHz

2 x 2 MU-MIMO Support

PHY Data Rate up to 867 Mbps (11ac VHT80)

Bluetooth v5.0

Host Interface

- WLAN : SDIO 3.0

- Bluetooth : UART

RoHS Compliant

Modular Certifications for North America, Europe and Japan

Product Name SX-SDMAC2-2830
Chipset QCA9379-3
Host Interface WLAN:SDIO3.0
Bluetooth:UART
WLAN Specification IEEE 802.11a/b/g/n/ac(2x2)
Bluetooth Specification Bluetooth v5.0 (BR/EDR/HS/LE Compliant
To support the Bluetooth v5.0 standard, you must use a Bluetooth stack and profile that support the Bluetooth v5.0 standard.
Antenna Connector MHF Connector:3
Power Main Power Supply :3.3V
SDIO Power Supply:
 -  SDIO2.0: 1.8V or 3.3V
 -  SDIO3.0: 1.8V
Operating Environment Temperature:-30~70℃
Humidity:15~95%RH (No Condensation)
Storage Environment Temperature:-40℃~85℃
Humidity:15~95%RH 結露無きこと
Dimensions 20.5×27.0×3.1 mm
Weight 5.1g
Package Type 68 pins Direct Solder Pads, Surface Mount Module
Certifications North America, Europe, and Japan

Preliminary Hardware Specifications (subject to change without notice)

For early access, please send in your inquiries to sales@silexamerica.com

Ready to Get Started?

Evaluate Now