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NEW: AMC Edge SoM, EP-200Q
Enabled by Qualcomm Dragonwing QCS6490 delivering always-on connectivity for edge AI.
Enabled by Qualcomm Dragonwing QCS6490 delivering always-on connectivity for edge AI.
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Tri-band Wi-Fi 6E plus Bluetooth® Combo SDIO Module Powered by NXP IW623
The SX-SDMAX6E delivers seamless tri-band connectivity (2.4 GHz, 5 GHz, and 6 GHz), powered by NXP’s IW623 chipset with a 2x2 MIMO configuration. It supports advanced features including MU-MIMO, OFDMA, Target Wake Time (TWT), and Bluetooth® LE Audio for next-level wireless performance.
With its SDIO interface, the SX-SDMAX6E is optimized for battery-operated devices, delivering improved power efficiency without compromising speed or reliability. Designed for easy integration with NXP i.MX processors and other platforms, it provides secure, plug-and-play connectivity with low latency and high throughput—even in dense, demanding environments.
As an NXP Gold Partner, Silex has worked closely with NXP Semiconductors from the earliest prototype stages of the IW623 chipset. This collaboration ensures that our driver software is not only optimized for performance but also independently verified and enhanced by Silex.
To simplify evaluation, we provide free drivers for NXP’s i.MX9x platform, enabling a smooth and efficient start. Beyond evaluation, Silex offers complete one-stop support - including software, hardware, wireless certification, and production services - helping you accelerate development and bring products to market with confidence.
6 GHz Band Support for Stable, Interference-Free Connectivity
In addition to the standard 2.4 GHz and 5 GHz bands, this module supports Wi-Fi operation in the 6 GHz band. With a larger number of available channels and no overlap with existing 2.4/5 GHz traffic, the 6 GHz band minimizes interference and congestion. Even in environments crowded with Wi-Fi devices, this ensures more reliable connections and stable equipment operation.
Boost Battery-Powered Devices with Speed and Efficiency
Designed with power-efficient SDIO connectivity, this module is ideal for wireless battery-powered devices, extending operational life without compromising performance. By combining high-speed Wi-Fi 6/6E 2-stream communication, it enables smooth wireless transmission of high-definition images, audio, and video alongside conventional data. This opens up new possibilities for medical, industrial, and other advanced applications, delivering both speed and energy savings.
Seamless Migration with SX-SDMAX6E
The SX-SDMAX6E shares the same form factor as the SX-SDMAX and even legacy Wi-Fi 5 SDIO modules, and is pin- and driver-compatible with the older SX-SDMAX Wi-Fi 6 module. This makes upgrading from Wi-Fi 6 to Wi-Fi 6E simple and hassle-free, allowing customers to save time, reduce development costs, and accelerate product deployment.
Premium Embedded Wireless LAN Modules, Developed and Made in Japan
Designed and manufactured at our Kyoto Keihanna headquarters, each SX-SDMAX6E module undergoes rigorous testing and calibration to ensure peak performance. Our software also passes stringent quality checks before release as a Silex Technology driver. Backed by over 20 years of industrial wireless expertise, this ensures reliable, high-performance connectivity—giving you confidence and stability in even the most demanding applications.
10-15 Year Lifecycle
Lengthen product longevity with NXP's 10-15 year lifecycle support. Silex uniquely procures and stores its components and has its own manufacturing facility to continue manufacturing products well after a component(s) used in the product goes EOL.
NXP Ecosystem
NXP customers on i.MX platforms can use NXP radios as a plug-and-play option with SX-SDMAXE, eliminating any driver development and integration efforts.
| SKU's |
Surface Mount SKU : SX-SDMAX6E-2530S M.2 Card (type 2230-S3-E) : SX-SDMAX6E-M2 |
|---|---|
| Chipset | NXP IW623 |
| Host Interface | WLAN: SDIO 3.0 Bluetooth: UART |
| Wi-Fi Standard |
Wi-Fi 6E IEEE 802.11a/b/g/n/ac/ax (2x2) |
| Bluetooth Specifications | Bluetooth v5.x (BR/EDR/LE Compliant) |
| Antenna | MHF1 x2 |
| Operating Voltage |
Main power: 3.3V + 1.8V IO power: 1.8V or 3.3V |
| Operating Environment | Temperature: -40 ~ 85 ℃ Humidity: 95% RH or less (Without Condensation) |
| Storage Environment | Temperature: -40 ~ 85 ℃ Humidity: 95% RH or less (Without Condensation) |
| Dimensions |
SX-SDMAX6E-2530S: 17.0 x 18.0 x 2.65mm SX-SDMAX6E-M2 : 22.0ｘ30.0ｘ4.45mm |
| Weight |
SX-SDMAX6E-2530S: 1.7g SX-SDMAX6E-M2 : 3.3g |
| Package Type |
SX-SDMAX6E-2530S: 44-pins Land Grid Array (Direct Solder) SX-SDMAX-M2 :M.2 Card type 2230-S3-E |
Having trouble? Our highly trained support team can help you find solutions for your technical issues.
