Silex Technology America, the global leader in providing  Wi-Fi solutions on June 2nd 2017 launched the latest embedded wireless solution , the SX-SDPAC. The SX-SDPAC SDIO System-in-Package(SiP) is a dual band 1x1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready” , which is based on Qualcomm Atheros QCA9377 System-on-Chip (SoC). With the smallest footprint of space, it is Wave 2 MU-MIMO 802.11ac. and  offers cost effective, and low power Wi-Fi+BT connectivity solution for our customers.

The SX-SDPAC brings 802.11ac throughput and range to battery operated electronic portable devices. This SiP is ideal for high-volume customers who want to achieve the lowest bill of material (BOM) cost and the smallest footprint. With the fact that it can be mounted directly on the devices PCBA, it reduces the usages of extra material and labor associated with the radio module or card, and thus minimising the cost. It is smaller in size, weighs light and consumes less power, which makes this an apt choice for wide range of applications like patient monitors, printers, headset, speakers, handheld terminals and many other Internet of Things (IoT) applications. 

The SX-SDPAC has been certified for FCC/IC and CE for the boundary Device module, the BD-SDPAC. We have released this product with our reference drivers for Linux, Android and Windows to provide flexibility to our customers. Our hardware and software expertise will help to enable 802.11ac connectivity for your application with SX-SDPAC.

To expedite the product development process, Silex also provides additional world-class engineering services including custom driver development, certification services and hardware schematic design reviews.

SX-SDPAC Features                                                                                                                                 

• Based on the QCA9377 Chipset
• Lowest cost 802.11a/b/g/n/ac implementation
• Wave 2 MU-MIMO
• SDIO 3.0 WLAN Host Interface
• Bluetooth 4.2 BR/EDR/LE Smart Ready
• On-chip Power Management Unit (PMU)
• Commercial Temperature, -20°C ~ +70°C
• Optional Antenna Diversity Support
• Internal 48 MHz XTAL
• Single-Ended Integrated RF Front-End Design
• Minimal Host Utilization (11ac speeds) via Offloading
• Smallest Size Package 6.9 mm x 6.9 mm x 1.082 mm

  To learn more about our offering contact us at sales@silexamerica.com.